• Electrical India
  • Aug 19, 2017

Dynex delivers world’s first hermetic, dynamic load-balancing, Press-pack IGBT

 Dynex Semiconductor, released a press release today announcing a significant industry-leading achievement: the initial delivery of the world’s first hermetic, dynamic load-balancing, Press-pack IGBT.

  The Dynex Press-pack IGBT range offers the following advantages over traditional press-pack IGBTs:

  1. Dynamic load balancing, ensuring uniform contact pressure for optimum current sharing and reliability.
  2. Mechanical overload protection.
  3. Suitability for use with standard pressure contact device clamps and heatsinks.
  4. Compact construction for market-leading current density.

  Clive Vacher, President and Chief Executive Officer, commented, “The design features of the new Dynex Press-pack IGBT deliver market-leading performance and reliability, even in the most extreme conditions.  This product is unique in the marketplace.  It encompasses the most technologically-advanced design of any press-pack in the world and will provide a new benchmark of performance in the industry.  Furthermore, it is designed for a wide range of customer applications: it will not only provide a more effective solution to existing and new-design press-pack based systems but also open up new industries to the benefits of switching to press-pack technology.”

Website: https://www.dynexsemi.com/products/semiconductors/presspack-igbt