Dynex delivers world’s first hermetic, dynamic load-balancing, Press-pack IGBT
Dynex Semiconductor, released a press release today announcing a significant industry-leading achievement: the initial delivery of the world’s first hermetic, dynamic load-balancing, Press-pack IGBT.
The Dynex Press-pack IGBT range offers the following advantages over traditional press-pack IGBTs:
- Dynamic load balancing, ensuring uniform contact pressure for optimum current sharing and reliability.
- Mechanical overload protection.
- Suitability for use with standard pressure contact device clamps and heatsinks.
- Compact construction for market-leading current density.
Clive Vacher, President and Chief Executive Officer, commented, “The design features of the new Dynex Press-pack IGBT deliver market-leading performance and reliability, even in the most extreme conditions. This product is unique in the marketplace. It encompasses the most technologically-advanced design of any press-pack in the world and will provide a new benchmark of performance in the industry. Furthermore, it is designed for a wide range of customer applications: it will not only provide a more effective solution to existing and new-design press-pack based systems but also open up new industries to the benefits of switching to press-pack technology.”